JPH0472793B2 - - Google Patents
Info
- Publication number
- JPH0472793B2 JPH0472793B2 JP62163988A JP16398887A JPH0472793B2 JP H0472793 B2 JPH0472793 B2 JP H0472793B2 JP 62163988 A JP62163988 A JP 62163988A JP 16398887 A JP16398887 A JP 16398887A JP H0472793 B2 JPH0472793 B2 JP H0472793B2
- Authority
- JP
- Japan
- Prior art keywords
- torr
- metal
- vacuum
- reaction
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62163988A JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62163988A JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS649878A JPS649878A (en) | 1989-01-13 |
JPH0472793B2 true JPH0472793B2 (en]) | 1992-11-19 |
Family
ID=15784626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62163988A Granted JPS649878A (en) | 1987-07-02 | 1987-07-02 | Bonding between silicon nitride ceramics and metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649878A (en]) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05117842A (ja) * | 1991-10-25 | 1993-05-14 | Ulvac Japan Ltd | 金属とセラミツクスの接合法 |
JP3495052B2 (ja) * | 1992-07-15 | 2004-02-09 | 株式会社東芝 | メタライズ体およびその製造方法 |
EP1617966B1 (en) * | 2003-03-30 | 2011-06-29 | L-3 Communications Corporation | Method of diffusion bonding a microchannel plate to a dielectric insulator ; diffusion bonded microchannel plate body assembly |
KR102496716B1 (ko) * | 2015-10-27 | 2023-02-07 | 주식회사 아모센스 | 세라믹 기판 제조 방법 |
JP2020145335A (ja) * | 2019-03-07 | 2020-09-10 | 株式会社Fjコンポジット | 回路基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0810710B2 (ja) * | 1984-02-24 | 1996-01-31 | 株式会社東芝 | 良熱伝導性基板の製造方法 |
JPH07110795B2 (ja) * | 1987-02-02 | 1995-11-29 | 住友電気工業株式会社 | 接合強度の優れたセラミツクスと金属の接合体 |
-
1987
- 1987-07-02 JP JP62163988A patent/JPS649878A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS649878A (en) | 1989-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |